一、科研项目：近期，限10项 (1)国家自然科学基金委员会，青年项目，52105158，封装互连结构I-II型复合蠕变-疲劳裂纹扩展规律及损伤机理，2022-01，30万元，在研，主持 (2) 国家自然科学基金委员会，面上项目，51675373，含二维裂纹反应堆压力容器断裂机理及结构安全评定方法，2017-01至2020-12，90万元，结题，参与 (3) 国家自然科学基金委员会，面上项目，51571150，促进骨愈合的可降解镁合金力-化调控机理研究，2016-01至2020-03，74.4万元，结题，参与 (4) 国家自然科学基金委员会，青年科学基金项目，51401145，裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究，2015-01至2017-12，25万元，结题，参与 二、代表性论著： [1] Yansong Tan, Zhenwen Yang, Shan Gao, Xin Li, Guo-Quan Lu*, Xu Chen. Feasibility investigation of and characterization of large-area DBA bonding by double-layer printing using nano-Ag paste, Soldering & surface mount technology, 2020, 32(3) 129-136. [2] Yansong Tan, Xin Li, Qitong Gao, Xu Chen*. Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint, International journal of adhesion and adhesives, 2019, 97.102488 [3] Yansong Tan, Xin Li*, Xu Chen, Guo-Quan Lu, Yunhui Mei. Low-pressure-assisted large-area (>800mm2) sintered-silver bonding for high power electronic packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(2):202-209. [4] Yansong Tan, Xin Li*, Xu Chen, Guo-Quan Lu. Elevated-temperature shear creep evolution and life prediction of sintered nano-silver lap-shear joint, Journal of Materials Science: Materials in Electronics, 2018, 29(1):303-312. [5] Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen*. Temperature-dependent dwell-fatigue behavior of nano-silver sintered lap shear joint, ASME Transactions & Journal of Electronic Packaging, 2016, 138:021001. [6] Yansong Tan, Xin Li, Gang Chen, Yunhui Mei, Xu Chen*. Three-dimensional visualization of the crack-growth behavior of [7] Yansong Tan, Xin Li*, Xu Chen. Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature, Microelectronic Reliability, 2014, 54(3): 648-653. [8] Shan Gao, Zhenwen Yang, Yansong Tan, Xin Li, Xu Chen, Guo-Quan Lu. Bonding of large substrates by silver sintering and characterization of the interface thermal resistance, 2017 IEEE Energy Conversion Congress and Exposition International Conference, October 1-5 2017, Cincinnati, America. (Conference paper) [9] Christina DiMarino, Dushan Boroyevich, Rolando Burgos, Mark Johnson, Meiyu wang, Yansong Tan, Guo-Quan Lu. High-Density, Planar 10 kV SiC MOSFET Power Module, 10th International Conference on Integrated Power Electronics Systems, 2018. (Conference paper) [10] 四、荣誉奖励： 无 |