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谭沿松
2021-07-28 09:23   审核人:   (阅读量:)

姓名

谭沿松

出生年月

1989年4月

性别

学历学位

博士

职称

讲师

导师类型

专硕导师

联系电话


所属院系

过程装备与控制工程

Email

tanyansong_tjut@163.com

人才称号

学术兼职

招生专业

学术型:(1)080200/机械工程

(2)专业代码**/专业名称**

专业型:(1)085500/机械

(2)专业代码**/专业名称**

研究方向

(1)SiC功率模块可靠性(2)生物材料断裂性能

一、科研项目:近期,限10项

(1)国家自然科学基金委员会,青年项目,52105158,封装互连结构I-II型复合蠕变-疲劳裂纹扩展规律及损伤机理,2022-01,30万元,在研,主持

(2) 国家自然科学基金委员会,面上项目,51675373,含二维裂纹反应堆压力容器断裂机理及结构安全评定方法,2017-01至2020-12,90万元,结题,参与

(3) 国家自然科学基金委员会,面上项目,51571150,促进骨愈合的可降解镁合金力-化调控机理研究,2016-01至2020-03,74.4万元,结题,参与

(4) 国家自然科学基金委员会,青年科学基金项目,51401145,裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究,2015-01至2017-12,25万元,结题,参与

二、代表性论著:

[1] Yansong Tan, Zhenwen Yang, Shan Gao, Xin Li, Guo-Quan Lu*, Xu Chen. Feasibility investigation of and characterization of large-area DBA bonding by double-layer printing using nano-Ag paste, Soldering & surface mount technology, 2020, 32(3) 129-136.

[2] Yansong Tan, Xin Li, Qitong Gao, Xu Chen*. Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint, International journal of adhesion and adhesives, 2019, 97.102488

[3] Yansong Tan, Xin Li*, Xu Chen, Guo-Quan Lu, Yunhui Mei. Low-pressure-assisted large-area (>800mm2) sintered-silver bonding for high power electronic packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(2):202-209.

[4] Yansong Tan, Xin Li*, Xu Chen, Guo-Quan Lu. Elevated-temperature shear creep evolution and life prediction of sintered nano-silver lap-shear joint, Journal of Materials Science: Materials in Electronics, 2018, 29(1):303-312.

[5] Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen*. Temperature-dependent dwell-fatigue behavior of nano-silver sintered lap shear joint, ASME Transactions & Journal of Electronic Packaging, 2016, 138:021001.

[6] Yansong Tan, Xin Li, Gang Chen, Yunhui Mei, Xu Chen*. Three-dimensional visualization of the crack-growth behavior of

[7] Yansong Tan, Xin Li*, Xu Chen. Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature, Microelectronic Reliability, 2014, 54(3): 648-653.

[8] Shan Gao, Zhenwen Yang, Yansong Tan, Xin Li, Xu Chen, Guo-Quan Lu. Bonding of large substrates by silver sintering and characterization of the interface thermal resistance, 2017 IEEE Energy Conversion Congress and Exposition International Conference, October 1-5 2017, Cincinnati, America. (Conference paper)

[9] Christina DiMarino, Dushan Boroyevich, Rolando Burgos, Mark Johnson, Meiyu wang, Yansong Tan, Guo-Quan Lu. High-Density, Planar 10 kV SiC MOSFET Power Module, 10th International Conference on Integrated Power Electronics Systems, 2018. (Conference paper)

[10]

四、荣誉奖励:

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